13th International Conference on Advanced Materials and Nanotechnology
Tohoku University, Japan
Title: Improvement of Cuo Nanostructure Fabrication Using Electrochemical Migration
Biography: Shintaro Fukaya
The CuO nanostructure has the physical properties as remarkable increase in surface-to-volume ratio and the nanostructure is used on the various fields, such as lithium ion batteries, solar batteries and so on. Recently, the CuO nanostructure is fabricated by hydrothermal synthesis and the various fabrication techniques for CuO have been studied.
Electrochemical migration (ECM) is known as a cause of invoking insulation deterioration on the printed circuit board in high-humid and -temperature environment. Although a considerable number of studies have been reported on suppressing ECM, utilization using ECM has not really been studied so far. The previous studies of suppressing reveal that eluting metal grows as dendrites. Recent years, the concern with utilization using ECM has been growing because ECM is the low cost and green fabrication technique and the reaction is caused by DC voltage and water. The attempt has been made at fabricating the CuO nanostructure using ECM. However, it has reported that ECM stops during growth of dendrites between electrodes because dendrites form short circuit. Thus, the sustainable and large-scale fabrication for the CuO nanostructure has not been established. The purpose of this study is to demonstrate sustainable and large-scale fabrication for the CuO nanostructure using ECM. In this study, we changed experimental conditions and evaluated these results.